TE Connectivity(美国泰科)
插件
¥4.42
46
类型:DIP,0.3"(7.62mm)行距,针位或引脚数(栅格):20(2 x 10),间距 - 配接:0.100"(2.54mm),触头表面处理 - 配接:锡,触头表面处理厚度 - 配接:60.0µin(1.52µm)
XKB Connectivity(中国星坤)
DIP-28
¥1.68
15
适配封装类型:DIP,结构:2x14P,间距:2.54mm,行距:7.62mm
XKB Connectivity(中国星坤)
DIP-10
¥2.56
278
适配封装类型:DIP,结构:2x5P,间距:2.54mm,行距:7.62mm
CONNFLY(晨翔)
DIP-32
¥0.327
77
适配封装类型:DIP,间距:1.78mm,行距:10.16mm,总PIN数:32P
XKB Connectivity(中国星坤)
SMD-4P
¥0.3854
0
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
CONNFLY(晨翔)
-
¥0.4174
560
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,总PIN数:6P
Nextron(正凌)
DIP-8
¥0.4551
1832
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
XKB Connectivity(中国星坤)
DIP-8
¥0.4977
60
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
XKB Connectivity(中国星坤)
DIP-16
¥0.756
57
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
XKB Connectivity(中国星坤)
DIP-20
¥0.69
105
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
XKB Connectivity(中国星坤)
DIP-8
¥1.6926
1029
适配封装类型:DIP,结构:2x4P,间距:2.54mm,行距:7.62mm
XKB Connectivity(中国星坤)
DIP-16
¥1.14
0
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
XKB Connectivity(中国星坤)
-
¥0.882
905
结构:2x5P,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
XFCN(兴飞)
DIP-6
¥1.37
918
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
XKB Connectivity(中国星坤)
SMD-28P
¥0.97
131
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
XKB Connectivity(中国星坤)
DIP-12
¥4.2042
940
适配封装类型:DIP,结构:2x6P,间距:2.54mm,行距:7.62mm
XKB Connectivity(中国星坤)
DIP-4
¥0.188
365
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
XKB Connectivity(中国星坤)
DIP-10
¥0.40605
6
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
Nextron(正凌)
DIP-8
¥0.553
0
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,总PIN数:8P
XKB Connectivity(中国星坤)
DIP-6
¥0.3563
71
适配封装类型:DIP,结构:2x3P,间距:2.54mm,行距:7.62mm
Nextron(正凌)
DIP-14
¥0.702
87
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
TE Connectivity(美国泰科)
插件
¥1.1011
1094
类型:DIP,0.3"(7.62mm)行距,针位或引脚数(栅格):18(2 x 9),间距 - 配接:0.100"(2.54mm),触头表面处理 - 配接:锡,触头表面处理厚度 - 配接:60.0µin(1.52µm)
Nextron(正凌)
DIP-20
¥0.972
52
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
Amphenol(安费诺)/FCI
插件
¥1.02773
0
类型:DIP,0.3"(7.62mm)行距,针位或引脚数(栅格):8(2 x 4),间距 - 配接:0.100"(2.54mm),触头表面处理 - 配接:锡,触头表面处理厚度 - 配接:100.0µin(2.54µm)
XKB Connectivity(中国星坤)
DIP-24
¥0.78
93
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
XKB Connectivity(中国星坤)
SMD-20P
¥0.925
26
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
CONNFLY(晨翔)
DIP-24
¥1.23
2588
Nextron(正凌)
DIP-28
¥1.38
0
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
Nextron(正凌)
DIP-24
¥1.47
0
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
Nextron(正凌)
DIP-28
¥1.49
0
适配封装类型:DIP,间距:2.54mm,行距:15.24mm,圆孔/方孔:圆孔
XKB Connectivity(中国星坤)
DIP-18
¥0.745
16
适配封装类型:DIP,间距:2.54mm,行距:15.24mm,圆孔/方孔:圆孔
Nextron(正凌)
插件-44P
¥1.96
0
适配封装类型:PLCC,间距:1.27mm,总针脚数:44P,工作温度范围:-55℃~+100℃
TE Connectivity(美国泰科)
插件
¥4.4271
3403
类型:DIP,0.6"(15.24mm)行距,针位或引脚数(栅格):28(2 x 14),间距 - 配接:0.100"(2.54mm),触头表面处理 - 配接:锡,触头表面处理厚度 - 配接:60.0µin(1.52µm)
XKB Connectivity(中国星坤)
DIP-32
¥2.49
0
适配封装类型:DIP,间距:2.54mm,行距:15.24mm,圆孔/方孔:圆孔
XKB Connectivity(中国星坤)
DIP-8
¥1.475
123
适配封装类型:DIP,结构:2x4P,间距:2.54mm,行距:7.62mm
XKB Connectivity(中国星坤)
DIP-32
¥4.2497
888
适配封装类型:DIP,结构:2x16P,间距:2.54mm,行距:7.62mm
BOOMELE(博穆精密)
DIP-24
¥0.188
0
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,总PIN数:24P
CONNFLY(晨翔)
DIP-32
¥0.3001
480
适配封装类型:DIP,间距:2.54mm,行距:15.24mm,总PIN数:32P
XKB Connectivity(中国星坤)
DIP-6
¥0.2796
90
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
XKB Connectivity(中国星坤)
DIP-6
¥0.3682
0
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
XKB Connectivity(中国星坤)
DIP-12
¥0.37345
175
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
XKB Connectivity(中国星坤)
DIP-12
¥1.16
0
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
XKB Connectivity(中国星坤)
SMD-10P
¥1.0126
0
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
XKB Connectivity(中国星坤)
DIP-16
¥0.85
33
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
XKB Connectivity(中国星坤)
DIP-12
¥0.36935
180
适配封装类型:DIP,结构:2x6P,间距:2.54mm,行距:7.62mm
XKB Connectivity(中国星坤)
DIP-28
¥2.21
0
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
XKB Connectivity(中国星坤)
DIP-10
¥1.026
31
适配封装类型:DIP,结构:2x5P,间距:2.54mm,行距:7.62mm
XKB Connectivity(中国星坤)
DIP-32
¥1.115
85
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
XKB Connectivity(中国星坤)
DIP-12
¥1.17
193
适配封装类型:DIP,结构:2x6P,间距:2.54mm,行距:7.62mm
XFCN(兴飞)
DIP-10
¥0.873
32
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔