Ckmtw(灿科盟)
DIP-40
¥0.431395
787
适配封装类型:DIP,间距:2.54mm,行距:15.24mm,总PIN数:40P
XFCN(兴飞)
DIP-14
¥1.2018
272
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
CONNFLY(晨翔)
SMD-32P
¥1.072
0
适配封装类型:PLCC,间距:1.27mm,总PIN数:32P,触头镀层:锡
Ckmtw(灿科盟)
DIP-24
¥0.242725
365
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,总PIN数:24P
CONNFLY(晨翔)
插件-44P
¥1.21
1386
适配封装类型:PLCC,间距:1.27mm,总PIN数:44P,触头镀层:锡
XFCN(兴飞)
DIP-8
¥1.69
1857
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
XKB Connectivity(中国星坤)
DIP-8
¥0.680407
550
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,总PIN数:8P
CONNFLY(晨翔)
DIP-20
¥1.08
696
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,总PIN数:20P
XFCN(兴飞)
DIP-16
¥1.4314
45
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
CONNFLY(晨翔)
-
¥2.17
369
适配封装类型:DIP,间距:2.54mm,行距:15.24mm,总PIN数:40P
Ckmtw(灿科盟)
DIP-6
¥0.11609
660
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,总PIN数:6P
洲日电子
DIP-18
¥0.11637
13
总PIN数:18P
DEALON(德艺隆)
DIP-8
¥0.464835
1680
适配封装类型:DIP,间距:2.54mm,圆孔/方孔:圆孔,触头材质:铍铜
Nextron(正凌)
DIP-40
¥2.1175
215
适配封装类型:DIP,间距:2.54mm,行距:15.24mm,圆孔/方孔:圆孔
XKB Connectivity(中国星坤)
DIP-16
¥1.596
438
适配封装类型:DIP,结构:2x8P,间距:2.54mm,行距:7.62mm
XFCN(兴飞)
DIP-12
¥2.15
2209
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
XKB Connectivity(中国星坤)
SMD-8P
¥0.4169
520
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
XKB Connectivity(中国星坤)
SMD-16P
¥1.0439
15
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
XFCN(兴飞)
DIP-20
¥1.79
32
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
XFCN(兴飞)
DIP-24
¥1.8
162
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
XFCN(兴飞)
DIP-24
¥2.19
68
适配封装类型:DIP,间距:2.54mm,行距:15.24mm,圆孔/方孔:圆孔
Nextron(正凌)
DIP-18
¥1.21
325
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
XKB Connectivity(中国星坤)
DIP-18
¥1.002
135
适配封装类型:DIP,结构:2x9P,间距:2.54mm,行距:15.24mm
Nextron(正凌)
DIP-28
¥1.55
192
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,总PIN数:28P
XFCN(兴飞)
DIP-32
¥1.404
109
适配封装类型:DIP,间距:2.54mm,行距:15.24mm,圆孔/方孔:圆孔
BOOMELE(博穆精密)
DIP-6
¥0.1597
160
适配封装类型:DIP,间距:2.54mm,总PIN数:6P
Ckmtw(灿科盟)
DIP-20
¥0.216125
12
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,总PIN数:20P
Nextron(正凌)
DIP-6
¥0.3327
0
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,总PIN数:6P
XKB Connectivity(中国星坤)
DIP-24
¥2.0475
125
适配封装类型:DIP,结构:2x12P,间距:2.54mm,行距:15.24mm
Nextron(正凌)
插件-28P
¥2.16
0
适配封装类型:PLCC,间距:1.27mm,总PIN数:28P,工作温度:-55℃~+100℃
XKB Connectivity(中国星坤)
DIP-40
¥4.24
19
适配封装类型:DIP,结构:2x20P,间距:2.54mm,行距:15.24mm
XFCN(兴飞)
DIP-10
¥0.8946
42
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
XKB Connectivity(中国星坤)
-
¥0.72
400
结构:2x4P,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
XKB Connectivity(中国星坤)
SMD-32P
¥1.374
121
适配封装类型:DIP,间距:2.54mm,行距:15.24mm,圆孔/方孔:圆孔
Nextron(正凌)
-
¥1.936
50
XKB Connectivity(中国星坤)
DIP-20
¥1.456
2507
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
XKB Connectivity(中国星坤)
DIP-20
¥1.758
545
适配封装类型:DIP,结构:2x10P,间距:2.54mm,行距:7.62mm
洲日电子
DIP-24
¥0.13752
130
总PIN数:24P
XKB Connectivity(中国星坤)
DIP-24
¥1.2313
659
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
CONNFLY(晨翔)
DIP-32
¥1.86
520
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,总PIN数:32P
Nextron(正凌)
插件-32P
¥1.8
0
适配封装类型:PLCC,间距:1.27mm,总PIN数:32P,工作温度:-55℃~+100℃
FOXCONN(富士康)
-
¥6.7118
181
适配封装类型:LGA,总PIN数:1151P
XFCN(兴飞)
DIP-10
¥0.482895
12
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
Nextron(正凌)
DIP-24
¥1.1664
86
适配封装类型:DIP,间距:2.54mm,行距:15.24mm,圆孔/方孔:圆孔
Nextron(正凌)
DIP-22
¥1.19
0
适配封装类型:DIP,间距:2.54mm,行距:10.16mm,圆孔/方孔:圆孔
Mill-Max Mfg. Corp.
-
¥1.65
0
焊尾类型:无尾,端接:焊接,长度 - 总体:0.136"(3.45mm),可接受的引脚直径:0.015" ~ 0.022"(0.38mm ~ 0.56mm),引脚孔直径:0.031"(0.79mm)
XKB Connectivity(中国星坤)
DIP-24
¥1.062
473
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
CONNFLY(晨翔)
-
¥1.32
147
适配封装类型:DIP,间距:2.54mm,行距:15.24mm,总PIN数:28P
XKB Connectivity(中国星坤)
SMD-24P
¥1.125
38
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔
XFCN(兴飞)
DIP-12
¥0.6435
359
适配封装类型:DIP,间距:2.54mm,行距:7.62mm,圆孔/方孔:圆孔